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July 2000

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Subject:
From:
Brian Ellis <[log in to unmask]>
Reply To:
Leadfree Electronics Assembly E-Mail Forum.
Date:
Thu, 13 Jul 2000 19:11:09 +0300
Content-Type:
text/plain
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text/plain (46 lines)
Chris

As OSPs are often partially polymeric, I believe that testing the components may
present certain difficulties due to the lack of certainty of a good ohmic
connection. Much easier to penetrate an oxide film.

Best regards

Brian

Chris Hunt wrote:

> I am interested to learn why component terminations are all metal finishes
> and haven't taken a leaf out of the PCB industry and used an organic coating
> as a solderability preservative.
> Any offers?
>
> Chris Hunt
> NPL
>
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