LEADFREE Archives

December 1999

Leadfree@IPC.ORG

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Subject:
From:
Bradley Edwin-EEB002 <[log in to unmask]>
Reply To:
Leadfree Electronics Assembly E-Mail Forum.
Date:
Fri, 3 Dec 1999 17:24:57 -0500
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In my mind the choices have been made.  The NEMI Pb-free Project has chosen
to move forward with Sn-3.9Ag-0.6Cu for our evaluations of reflow
appliations and Sn-0.7Cu
and Sn-3.5Ag for wave applications.  European activities have also
identified
the Sn-Ag-Cu family as the recommended Pb-free alloy family.  Thus the
component finishes must work with those similar alloys.  There is no need to
wait until April 2000, the OEMs and EMSs have already made the choice and
the solder suppliers can supply these alloys.

Regards,
Edwin Bradley
Chair of the NEMI Pb free project

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