Microsoft? I doubt it.
A relative of mine is an executive at the Redmond Beast, and he couldn't
figure out why one should be amused seeing him do his homework on an
Apple laptop "borrowed from work."
--- Previous Message in This Thread ---
Subject: Re:[LF] Fodder for Discussion?
From: Stadem, Richard D. <[log in to unmask]>
To: [log in to unmask]
Date: Tuesday, January 19, 2010 12:49:52 PM
> I bet the manufacturers of the Xbox 360 would go back to leaded solder!
> ;-)
>
>
> -----Original Message-----
> From: Leadfree [mailto:[log in to unmask]] On Behalf Of Dennis Fritz
> Sent: Tuesday, January 19, 2010 2:43 PM
> To: [log in to unmask]
> Subject: Re: [LF] Fodder for Discussion?
>
> Let me pose the same question I did recently in the aerospace/defense
> community -
>
> "Now that cellphone and laptop manufacturers have been exposed/adopted
> lead-free solder, would they go back to leaded solder"?
>
> I maintain that now that the engineering is done to learn lead-free,
> there are scientific reasons to keep many products lead-free. Do you
> agree that even though lead-free costs more per gram, there are
> electronics constructions where lead-free is worth the extra cost, based
> on performance?
>
> More fodder.
>
> Denny Fritz
> SAIC, Inc
>
>
>
>
>
>
> -----Original Message-----
> From: Marcus L. Thompson <[log in to unmask]>
> To: [log in to unmask]
> Sent: Tue, Jan 19, 2010 3:30 pm
> Subject: Re: [LF] Fodder for Discussion?
>
>
> "In my practice, over the last 15 years, the most frequent type of
> failures has been SnPb creep failures in single-sided through-hole
> joints."
>
> Thank you, Jean-Paul, for weighing in here. I do not doubt your
> experience.
>
> However, assuming anything near commonsense design and proper assembly
> techniques, I've never experienced nor heard of any such problem with
> Sn/Pb.
>
> Perhaps one could say that, on balance, issues such as this were quite
> rare before we had been informed of the evils of lead?
>
> Thanks again --
>
>
> --- Previous Message in This Thread ---
> Subject: Re:[LF] Fodder for Discussion?
> From: Jean-Paul Clech <[log in to unmask]>
> To: [log in to unmask]
> Date: Tuesday, January 19, 2010 11:57:13 AM
>
>>>> Search for GPU failures and you will find that SnPb solder joints
> have > failed recently aswell, in areas where SnPb products are still
> sold (including > North America).
>>> A few years ago (~5-7 years ago), a Danish consumer organization had
> a > technical report on the internet, showing laptop SnPb solder joint >
> creep/fatigue failures after < 2-3 years of use. In my practice, over
> the last 15 > years, the most frequent type of failures has been SnPb
> creep failures in > single-sided through-hole joints. I am sure that
> Werner can add to the list. > Unfortunately, the parties involved are
> reluctant to publish.
>>> In many of these cases, SnPb or lead-free, the main issue is a lack
> of > design-for-reliability (e.g. detrimental effect of stiff leads,
> large > temperature swings in use, poor choice of materials etc...).
> These issues will > stay, regardless of solder compositions. No doubt
> that the problem has been > compounded by the introduction of new (often
> uncharacterized) alloys.
>>> Best,
>> Jean-Paul
>>>> In a message dated 1/19/2010 2:01:30 P.M. Eastern Standard Time, >
> [log in to unmask] writes:
>>> You think the Xbox issue is the only one; laptop failures are a real
> issue > as well.
>>>>>>>>> Quote of the month (not necessarily monthly): > "Quality
> means doing it right when no one is looking", Henry Ford.
>> _______________________________________________
>> Jean-Paul Clech
>> EPSI Inc. -- There is no short cut to reliability.
>> P.O. Box 1522, Montclair, NJ 07042, USA
>> tel. & fax:+1 (973)746-3796
>> _http://www.jpclech.com_ (http://www.jpclech.com/) > >
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