Hi Again Doug, and IPC LF Listservers,

I would like KeithS to come out and add just a little on how he does LF on
Paper Laminate. If I remember right the Tg of some of the paper phenolics
are less than glass and Keith might be able to tell us the Tg of the
material he used. It is probably a simple design with simple, and small
components.

I have also seen reports of LF being done on standard 115-125 Tg FR4/Gll
which leads me to say you will need a higher Tg only if your printed
circuit board assembly needs it.

On the other hand I know some of the KEDS products (ABS Brakes) that
Rick produces and he will probably need the higher Tgs for some of
their products.

I think we all know that the large CEMs or EMS houses are pushing for
higher temperatures (260 peak vs 235 in reflow) yet that is because
they have PWB, PWA, board, planar, and component complexity.


Thanks KEDS-Rick for the lead on the APEX paper.


Yours in Engineering, Dave
YiEng, MA/NY DDave

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