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Subject:	Re: Passives in lead-free
From:	Werner Engelmaier <[log in to unmask]>
Reply To:	(Leadfree Electronics Assembly Forum)
Date:	Tue, 14 Jun 2005 12:57:45 EDT
Content-Type:	text/plain
Parts/Attachments:	text/plain (24 lines)

Hi Ioan,
You do not need to make the stencil thicker, just enlarge the stencil opening
for more solder paste volume.



Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com


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