CALL FOR PAPERS
"Lead-Free, Lead-Bearing Solders and Alternative Surface Finishes for
Electronic Packaging."
To be held during 2001 TMS Fall Meeting at Indianapolis, IN, from November 4
to 8, 2001.
This symposium will cover all aspects of solders, surface finishes,
component lead finishes, and the interactions between these materials
relevant to electronic packaging. Papers on solders and surface finishes for
PWB, BGA, flip-chip, CSP, optoelectronic packaging, and MEMS packaging are
welcome. Topics include, but are not limited to, lead-free solders,
lead-bearing solders, surface finishes, bumping materials, and lead frame
materials. This symposium is organized with an emphasis of bringing
researchers from different disciplines together. Issues related to design of
solders, phase equilibria, soldering technologies, processing,
microstructures, properties, chemical interactions, electromigration,
failure mechanisms, and reliability of solder joints will be discussed.
Abstracts are due by March 15, 2001. Please submit abstracts directly to
http://www.tms.org/cms.
Organizers:
C. Robert Kao, National Central University
Department of Chemical Eng., Chungli City, Taiwan
Tel: +886-3-4227382, Fax: +886-3-4227382, e-mail: [log in to unmask]
Srinivas Chada, Motorola
8000 West Sunrise Blvd., Fort Lauderdale, FL 33322
Tel: (954) 723-5293, Fax: (954) 723-5584, e-mail:
[log in to unmask]
Zequn Mei, Agilent Technologies
3500 Deer Creek Road, MS 24M-C, Palo Alto, CA 94304
Tel: (650) 485-3497, Fax: (650) 485-2794, e-mail: [log in to unmask]
G. Ghosh, Northwestern University
Department of Materials Sci. and Eng., 2225 N. Campus Dr., Evanston, IL
60208
Tel: (847) 467-2595, Fax: (847) 491-7820, e-mail: [log in to unmask]
S. W. Chen, National Tsing-Hua University
Department of Chemical Eng., Hsinchu City, Taiwan
Tel: +886-3-5721734, Fax: +886-3-5715408, e-mail: [log in to unmask]
Prasad S. Godavarti, FlipChip Technologies
3701 E. University, Phoenix, AZ 85034
Tel: (602) 431-6020x278, e-mail: [log in to unmask]
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