LEADFREE Archives

August 2001

Leadfree@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Guenter Grossmann <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Fri, 10 Aug 2001 08:56:28 +0200
Content-Type:
text/plain
Parts/Attachments:
text/plain (29 lines)
Wayne

Yes, what you say is the same thing as my findings indicate. Since alloys with a high contents of Sn creep slower than SnPb and fatigue is strain driven the lead free alloys perform better in accelerated thermal cycling tests. However, the difference in reliability between SnPb and lead free alloys gets smaller as soon as the dwell times get longer or the upper temperature of the cycle is increased. 

Best regards

Guenter

Guenter Grossmann

Swiss Federal Institute for Materials Testing and Research EMPA
Centre for Reliability
8600 Duebendorf
Switzerland

Phone: xx41 1 823 4279
Fax :      xx41 1823 4054
mail:     [log in to unmask]

---------------------------------------------------------------------------------
Leadfee Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Leadfree
To temporarily stop delivery of Leadree for vacation breaks send: SET Leadfree NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2