NEMI and its members have completed extensive manufacturing and reliablity
studies with the Sn3.9Ag0.6Cu alloy and with Sn3.0Ag0.5Cu.  Information on our
results can be obtained at
http://www.nemi.org/projects/ese/lf_hottopics.html
There are several current NEMI Pb-free solder projects that are also described
there.

Additional complementary studies were performed by HDPUG and can be found at
http://www.hdpug.org/public/4-papers/x-ref/lead-free.htm

The NEMI and HDPUG studies found similar results.

NEMI is proposing to start a new project titled
"Evaluation of Substrate Surface Finishes for Pb-free Assembly Initiative:
Objective:
Evaluate the effects of alternative surface finishes for circuit boards and
package substrates on Pb-free solder joint reliability during mechanical stress
testing."
Additional information can be found at:
http://www.nemi.org/projects/call_part_evaluation_sub.html

**************************************
Carol A. Handwerker
Chief, Metallurgy Division
NIST
100 Bureau Drive Stop 8550
Gaithersburg MD 20899-8550
Office:(301) 975-6158
Fax:(301) 975-4553

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