Subject: | |
From: | |
Reply To: | (Leadfree Electronics Assembly Forum) |
Date: | Thu, 15 Jul 2004 08:55:55 -0700 |
Content-Type: | text/plain |
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-----Original Message-----
From: McCullen, Jack T
Sent: Thursday, July 15, 2004 8:49 AM
To: McCullen, Jack T
Subject: RE: [LF] Question on maximum reflow temperature in Jedec
Standard - J-STD-020B
I just looked at the table as it was in the listserv and noticed that it
could be messed up depending on the number of characters per line. I
narrowed it down so it should look OK on all systems.
J-STD-020C will be published this week or early next week.
Regards
Greg,
J-STD-020C uses a table to indicate the maximum reflow temperature. The
table is based on package volume and package thickness. The standard is
approved and is in the publication process and will be available
shortly.
Regards,
Jack McCullen
Package Volume mm3 Volume mm3 Volume mm3
Thickness < 350 350 - 2000 > 2000
< 1.6 mm 260C 260C 260C
1.6 mm - 2.5 mm 260C 250C 245C
> 2.5 mm 250C 245C 245C
* Tolerance: The device manufacturer/supplier shall assure process
compatibility up to and including the stated classification temperature
(this means Peak reflow temperature +0 C. For example 260 C +0C) at the
rated MSL level.
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Greg Kowal
Sent: Wednesday, July 14, 2004 10:31 AM
To: [log in to unmask]
Subject: [LF] Question on maximum reflow temperature in Jedec Standard -
J-STD-020B
Hello all,
The current standard has for pb-free large body a maximum reflow of
245C. I believe there was some discussion this would be revised to be
a maximum reflow temperature of 260C. Can anyone verify if this is
really the case and if so, when should we expect the revision to occur?
Regards,
Greg Kowal
p.s. I have been a "lurker" here for a while and have learned a lot.
Thank you to everyone who contributes.
______________________________________________________________________
Post your free ad now! http://personals.yahoo.ca
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