Haven't done any BGAs as of yet, LF or otherwise, but from what I've read you need to get the ball solder to liquidus during the process for the best solder joint. Thus you may need to run at a higher temperature, assuming the other parts on your assembly can handle it.

We've been having similar issues with what we suspect are LF parts, having to run boards a little hotter through the process to get sufficient wetting. 

Blair

>>> [log in to unmask] 06/14/05 04:44AM >>>
Hi , somebody have experience in assembly using BGA lead free , but in
solder process lead ?
What about the quality of the solder joint and the quality ? 

BGA lead free
Solder paste lead
thermal profile for process lead 

Thx.
FAbrizio



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