Denny,
A lot of what is in the "Manhattan Project" is a long list of things that need to be done, not what we know, and a lot of it is very academic, not reliability specific.
Werner
-----Original Message-----
From: Dennis Fritz <[log in to unmask]>
To: [log in to unmask]
Sent: Tue, Jan 19, 2010 3:38 pm
Subject: Re: [LF] Fodder for Discussion - source of information!!!
Marcus -
A large amount of information has been accumulated in the Aerospace/Defense
community about lead based versus lead-free solders/solder joints. A good place
to start to tap this knowledge has recently been gathered at the Defense
Acquisition University web site:
https://acc.dau.mil/leadfree
I will point out the second item on the list - the Lead-free Electronics
"Manhattan Project" to compile the "best practices" for use of lead based or
lead-free solder in harsh environements. 15 leading metallurgical scientists in
the US met for two weeks to compile this 350 page baseline. Since then, the
same 15 met again in August to outline the required research to close the
knowledge gaps between leaded and lead-free solder, particularly in harsh
environments.
The above Manhattan Project document was published in limited edition hard bound
form for distritution to key DoD/Aerospace managers to help stimulate expending
about $95 million, on the projects from the Phase 2 Roadmap.
The $95 million seems like a lot, but a drop in the bucket compared to the
estimated expenditure of $40 billion so far around the world in the move to
lead-free.
Denny Fritz
SAIC, Inc.
-----Original Message-----
From: Marcus Thompson <[log in to unmask]>
To: [log in to unmask]
Sent: Tue, Jan 19, 2010 12:25 pm
Subject: [LF] Fodder for Discussion?
Good day to all.
In light of a recent interchange addressing SAC balls on BGA packages, I
hought that I'd toss a mass-marketed item out here for discussion: the Xbox
60. Despite the generally kitsch nature of this product, I believe that
ome fruitful insights may be taken from the example nonetheless.
In short, how do we define the billion-dollar lead-free SJ failures which
ave plagued this particular specimen? As many have observed concerning
green" solder formulations, the joints thus formed are more susceptible to
etallurgical failure modes of various types vs. Sn/Pb. Yet, I have gleaned
hat some carefully devised testing (by ostensibly impartial researchers)
as demonstrated the converse; promoting the cause for complete replacement
f Sn/Pb across the board (so to speak).
To sum, apart from whiskering concerns (Swatch?), is there clear evidence
hat lead-free solder metallurgies per se are indeed a "non-issue?" If so,
here does the case of the "Xbox" product failures need to be finally
lassified?
Thanks again --
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