CALL FOR PARTICIPATION
IPC and SOLDERTEC bring you the
International Conference on Lead-Free Electronics
"Towards implementation of the RHS Directive"
June 10 and 13, 2003 *Education Courses/ Workshops
June 11-12, 2003 *Technical Conference
Conrad Hotel, Brussels, Belgium
The EU RHS Directive (Restriction of Hazardous Substances in Electrical
and Electronic Equipment) came into force in February 2003 confirming
the long expected requirement for all affected electrical equipment put
on sale in Europe from 1 July 2006 to be lead-free. This ban in Europe
will affect the global marketplace, forcing all manufacturers to
eliminate lead as effectively as a local ban - manufacturers in all
regions, including Asia, will need to prepare for this change. Producers
of equipment not directly affected by the legislation e.g. aerospace,
need to assess the effects of changes in the supply chain and customer
demand.
IPC - Association Connecting Electronics Industries and SOLDERTEC - a
division of Tin Technology, are sponsoring an International Conference
on Lead-Free Electronics June 10-13, 2003 in central Brussels, Belgium,
to bring together top class experts for the first major conference on
this subject to be held in Europe. All suppliers, assemblers and
retailers need to be aware of the current situation in order to achieve
lead-free product sales by 2006.
PAPER SUBMISSION
Papers are sought in all areas, including:
*European/other legislation on hazardous materials and recycling, policy
enforcement etc
*Summary of voluntary implementation/legislation/research in other
regions (America, Japan, China, Taiwan etc)
*Design issues (for ease of production and disassembly)
*PWB issues (effects of lead-free process temperatures, board finishes
etc)
*Component issues (effects of lead-free process temperatures, BGA's ,
obsolescence etc)
*New finishes (plating technology, solderability and tin whiskering)
*Comparisons of solder alloys (mainstream (e.g. SnAgCu, SnCu) and
specialist (e.g. SnZnAl) compositions)
*Alternative means of substitution (conductive adhesives etc)
*Lead-free manufacturing (examples of implementation, process
considerations, inspection etc)
*Repair and rework (process control, mixed alloy systems etc)
*Reliability evaluations (research, product test and in-service,
including new test methods)
*Lead-free and other product sectors (automotive, aerospace etc)
*Environmental considerations and studies (material availability,
toxicity issues etc)
*Recycling (examples, plans and concerns)
*Business issues (supply chains, cost - benefit analysis etc)
The Conference offers 30-45 minute time slots to allow time for the
presentation and discussion. Some papers may be grouped together in a
forum or panel discussion.
Please submit 2-300 word abstracts along with the attached form and a
brief biography. The deadline for abstract submission is 2 April 2003.
Presentation materials and papers must be non-commercial in nature,
focusing on technology rather than a company's product. It is mandatory
to electronically provide a print-quality paper for the Conference
Proceedings. If your paper is accepted, format guidelines will be
provided and the deadline for paper submission is 5 May 2003.
Speakers will receive free admission to the conference, including a copy
of proceedings, and any refreshments.
EDUCATIONAL COURSES
Proposals are also solicited from individuals interested in teaching
full-day tutorials (six hours) or half-day workshops (three hours) to a
class of up to 30 persons on topics in the field. Examples include;
reliability, process issues, rework, plating and surface finishes,
design for lead-free, design for recycling etc. Additional suggestions
are also welcome.
An honorarium is offered to tutorial and workshop instructors. A brief
description and additional information on any such proposals should be
submitted according to the guidelines for abstract submission i.e. by
completion of the attached form.
SPONSORSHIPS AND EXHIBITS
Companies interested in event sponsorship opportunities or exhibiting in
our tabletop exhibition space please email [log in to unmask]
REGISTRATION INFORMATION
If you are interested in receiving registration information regarding
the IPC/Soldertec International Conference on Lead-Free Electronics,
please send an email to [log in to unmask]
Abstract and Workshop Topic Submission
IPC/SOLDERTEC International Conference on Lead-Free Electronics -
Towards Implementation of the RHS Directive
Brussels, June 2003
When complete, please fax or e-mail this form with your biography and
abstract to:
Kay Nimmo
SOLDERTEC at Tin Technology Ltd
Kingston Lane, Uxbridge, Middx, UB8 3PJ, UK
Tel : +44 (0)870 458 4242 Fax: +44 (0)870 458 4273
E-mail: [log in to unmask]
Name
Company
Title
Street Address
City
Post/Zip Code
Country
Phone
Fax
E-mail
On a separate page, please include a paragraph-length biography and your
200-300 word abstract describing the presentation you wish to have
considered for the Conference.
Presentation Title:
Indicate the general area of Lead-Free Technology:
Design
Applications
Assembly
Components
Market
Packaging
Materials
Other
Has this paper been presented before?
If yes, when and where?
*Send Proposal prior to 2 April, 2003
*Paper Submission due before 5 May, 2003
David W. Bergman, CAE
Vice President, Standards, Technology & International Relations IPC 2215
Sanders Road #250
Northbrook, IL 60062-6135 USA
Direct Phone 847-790-5340
IPC Main Phone 847-509-9700
Direct Fax 847-504-2340
Mobile 847-867-1388
email [log in to unmask]
IPC website www.ipc.org
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