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Subject:	Fw: [LF] Fwd: IPC News Release: Assembly Industry Asks Suppliers to ChooseAlloy
From:	David Suraski - AIM <[log in to unmask]>
Reply To:	Leadfree Electronics Assembly E-Mail Forum.
Date:	Fri, 10 Dec 1999 11:52:45 -0500
Content-Type:	multipart/mixed
Parts/Attachments:	text/plain (686 bytes) , message/rfc822 (4 kB)

Not to be too blunt, but this press release is just plain wrong.  The
alternative alloy roadmap session proposed SnAgCu as the alternative alloy.
SnAgBi was discussed as a secondary alloy for specific SMT applications
only, and only pending a series of lead-contamination tests.  This is
verified in the session leader's notes (PP Presentation).

As I have seen this error in a variety of publications, I think that this
merits immediate resolution.
-----Original Message-----
From: Christopher Jorgensen <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Friday, December 03, 1999 10:22 AM
Subject: [LF] Fwd: IPC News Release: Assembly Industry Asks Suppliers to
ChooseAlloy

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