We have an IC we are using that is a "CASON" package.
Instead of leads, it just has pads on the bottom of the device.  I think
it fits in a small outline layout.
The only other "leadless" device I am familiar with, really, is a BGA,
and those, the general consensus is that they shouldn't be switched to
RoHS without switching the solder paste, as well.  
So my question is, are there any issues with switching a CASON pkg to
RoHS while still using SnPb solder paste?

Genny Gibbard (mailto:[log in to unmask])
VCom Inc.
150 Cardinal Place
Saskatoon, SK   S7L 6H7
(306)955-7075 x.229


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