Dear Han,
In response to your question (2) below, all of our testing has demonstrated
that SnAgCu alloys with lower silver levels are at least equally as viable
as those with 3.5Ag or greater. In fact, I have before offered to this list
wetting curves that demonstrate that SnAgCu alloys with less than 3Ag
actually wet faster and stronger than those with higher Ag percentages.
And, of course, lower Ag equals lower costs, especially for bar and wire,
but for paste as well.
For these reasons, many have chosen SnAgCu alloys with 3Ag or less to focus
upon. In fact, JEIDA (which seems to be the Japanese equivalent of NEMI but
I may be mistaken) has recommended a SnAgCu alloy with 3Ag for their roadmap
recommendation.
Best Regards,
David Suraski
AIM
800-CALL-AIM / 401-463-5605
----- Original Message -----
From: "HAN,JIANG-BO (A-Singapore,ex1)" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, October 24, 2000 4:51 AM
Subject: Re: [LF] Timelines for conversion to Lead-Free
> Hi Kay,
>
> Great thanks for information. Three more related questions.
>
> (1) According to normal practice, when the WEEE proposal can reach to the
> Council (of Ministers of each
> country), which should be the last stage before the proposal becomes a
> legislation?
>
> (2) What potential challenges one may face when using a SnAgCu alloy with
> low percentage of Ag (say, <3.4%)
>
> (3) Does any organization/company consider to sue a SnCu alloy for RI
reflow
> applications?
>
>
> Best regards,
> Han
>
>
>
> -----Original Message-----
> From: Kay Nimmo [mailto:[log in to unmask]]
> Sent: Tuesday, October 24, 2000 3:53 PM
> To: [log in to unmask]
> Subject: Re: [LF] Timelines for conversion to Lead-Free
>
>
> Dear Han
>
> On Question 1:
>
> The Brite-Euram collaborative project in Europe on lead-free soldering
> (IDEALS) concluded that a Sn-3.8Ag-0.7Cu alloy was suitable for the
> applications tested. This work was completed in April 1999. You can see a
> summary report at http://www.compete.tm.fr/reports/ideals.pdf
>
> Soldertec at ITRI produced a statement on the best options for lead-free
> solder alloys considering the current industry considerations (i.e.
> potential Pb contamination) in october 1999. This can be seen at
> http://www.lead-free.org/download/files/pdf/lead_free_thewayforward.pdf
This
> document indicated Ag levels as low as 3.4% in SnAgCu would be acceptable,
> however, further work is expected to show that Ag levels even below that
> could be used. The statement also included SnAgBi for surface mount and
SnCu
> as a potential alternative for wave soldering.
>
> The NEMI recommendation for the Sn-3.9Ag-0.6Cu was made in January 2000.
> NEMI do not recommend the use of Bi containing alloys. The press release
can
> be found at http://www.nemi.org/PbFreePUBLIC/index.html
>
>
> On Question 2:
> Euro legislation must be agreed by three bodies before it is officially
> accepted; the European Commission (administrative body), the European
> Parliament (elected representatives) and the Council (of Ministers of each
> country).
>
> The WEEE directive proposals were agreed and adopted by the various
sections
> of the Euro Commission in July 2000. The document is now an official
> proposal but this is only the first stage of the process. It must also be
> discusssed and agreed by the Euro Parliament and the Council before it is
> accepted.
>
> The current date of 2008 for a lead ban could still be changed (to get
> nearer or to get further away).
>
> Hope that helps
>
> Kay Nimmo
>
> +++++ Visit our lead-free.org website +++++
> ITRI Ltd, Kingston Lane, Uxbridge, Middx, UK, UB8 3PJ
> tel: +44 (0)1895 272406 fax: +44 (0)1895 251841
> email: [log in to unmask] www.itri.co.uk and www.lead-free.org
>
>
> -----Original Message-----
> From: Leadfree [mailto:[log in to unmask]]On Behalf Of HAN,JIANG-BO
> (A-Singapore,ex1)
> Sent: 24 October 2000 04:47
> To: [log in to unmask]
> Subject: Re: [LF] Timelines for conversion to Lead-Free
>
>
> Hi,
>
> I would like to confirm two pieces of information.
> (1) Europe has recommended NEMI's selection (SnAgCu) as the 'standard'
> eutectic tin-lead solder replacement.
> (2) EC WEEE proposal has been officially adopted.
>
> Appreciate if anyone can help to clarify whether the above is true.
> Best regards,
> Han Jiangbo, Agilent Technologies
>
> --------------------------------------------------------------------------
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