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November 2008

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Subject:
Re: Accelerated reliability model for SAC405/305 solder joint creep-fatigue
From:
Werner Engelmaier /* <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Fri, 14 Nov 2008 17:04:54 EST
Content-Type:
text/plain
Parts/Attachments:
text/plain (30 lines) 
Hi Reuven,
Look for my reliability column in the december issue of Global SMT & 
Packaging magazine.
What are "Crakes"?   Whiskers fall under the category of   'Non-Repeatable 
Experiments'—how could you possibly model them?

Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com



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