Maybe an easier way for Europeans interested in the subject would be to
attend the IMAPS Nordic (International Microelectronics and Packaging
Society, Nordic Chapter) Conference on September 19-22 in Helsinki, Finland.
Michael Pecht is giving a one-day tutorial on 19 September on the subject.

For more information visit the IMAPS Nordic web site
http://www.imapsnordic.a.se.

Regards,
Marja

-----Alkuperäinen viesti-----
Lähettäjä: David Bergman [mailto:[log in to unmask]]
Lähetetty: 5. elokuuta 1999 15:46
Vastaanottaja: [log in to unmask]
Aihe: Re: ÄLFÅ Uprating Short Course


Since higher processing temperatures are needed with some of the new alloys,
I
thought some would find this announcement of interest.
Regards
Dave Bergman, IPC

>>> "Joan Pecht" <[log in to unmask]> 08/03/99 03:40PM >>>
Course Announcement:
How to Select and Use Electronic Parts Outside the
Manufacturer-Specified Temperature Range

Held on:
October 11, 1999

Held at:
CALCE Electronic Products and Systems Center
University of Maryland, College Park

Instructors:
Dr. Michael Pecht, Professor and Director, CALCE EPSC and Industry
specialists

For more details please visit:
http://www.calce.umd.edu/general/course/coursum.htm


Course Outline

Several industries, including avionics, automotive, military, and
telecommunication are facing problems with obtaining electronic parts
rated for the temperature ranges required for operation.  Legacy parts
rated for extended (e.g., military, industrial, automotive)
temperature ranges are being discontinued by semiconductor
manufacturers.  In addition, more advanced and affordable (e.g., low
voltage, low power) functionalities are being introduced, but only for
narrower temperature ranges.

To stay competitive, both technically and economically, industries may
need to consider using parts whose data sheet temperature limits are
not broad enough to meet the application environment.  Uprating is a
process to assess the ability of a part to meet the functionality and
performance requirements of the application in which the part is used
outside the manufacturers' specification range.  This short course
will introduce the participants to the design, assembly, test, legal
and cost issues related to uprating and use of uprated parts.


Program Outline

Taught By: Michael G. Pecht, University of Maryland
8:00 Opening: Introduction to uprating

Taught By: Raymond B. Biaginni, McKenna and Cuneo LLP.
(Law firm specializing in product liability)
9:00 Legal risks and risk mitigation methods
Product liability theories
Basics of a plaintiff's product liability case
Strict liability
Negligence
Failure to warn
Who's at risk - three categories of increasing risk
Pass-through of electronic parts
Modifications and alterations, but no change to basic function
Use of parts outside environments specified by manufacturers
Preventative measures to maximize key defenses
Government contractor defense
Contract specification defense
Other significant defenses

10:30 Break

Taught by: Michael G. Pecht, University of Maryland
10:45 Technical risks and risk mitigation methods
Integration with part selection and management
Consideration of alternatives
Consideration of system level uncertainties
Following best known practices
Obtaining and interpreting part information accurately
Risk mitigation is electrical testing
Ensuring appropriate electrical test coverage
Determining and accounting for electrical parameter variations
Minimizing damage from part handling and testing
Maintaining proper documentation
Risk mitigation across supply chain
Part manufacturer
Distributor
Contract manufacturer
Test laboratory
Customer
Assessing part reliability at extended temperature
Tracking and evaluating effects of technology trends

12:00 Lunch

1:00 Methods of uprating and definitions
Parameter conformance assessment
Parameter re-characterization
Stress balancing
How to assure quality of incoming parts
When to re-uprate
Taught by: Chris Wilkinson, Smiths Industries

2:30 Break

Taught by: Representative of  Bell Technologies (Test Laboratory)
2:45 Which parts can and cannot be uprated
What does the future hold?

3:45 The economics of uprating
Costs of uprating alternatives
Non-recurring cost
Recurring costs
Future trends

4:30 Adjourn

Michael Pecht is the Director of the CALCE Electronic Products and
Systems Consortium (EPSC) at the University of Maryland and a Full
Professor with a three way joint appointment in Systems Engineering,
Mechanical Engineering, and Engineering Research.  Dr. Pecht has a BS
in Acoustics, a MS in Electrical Engineering and a MS and PhD in
Engineering Mechanics from the University of Wisconsin.  He is a
Professional Engineer, an IEEE Fellow, an ASME Fellow and a
Westinghouse Fellow.  He has written eleven books on electronics
product development.  He served as chief editor of the IEEE
Transactions on Reliability for eight years and on the advisory board
of IEEE Spectrum.  He is currently the chief editor for
Microelectronics Reliability.  He serves as an advisor for various
companies and the U.S. government, providing expertise in strategic
planning in the area of electronics products and systems development.

Raymond B. Biagini is a partner in the Washington, D.C. office of
McKenna & Cuneo, LLP.  He joined the firm in 1980 and is a member of
the firm's Management Committee.  Mr. Biagini's practice focuses on
product liability litigation, and he has substantial trial and
litigation experience.  As a leader of the firm's Product
Liability/Toxic Tort Practice Group, he has defended manufacturers,
system integrators, and component providers involving weapon systems,
products made for civilian government agencies as well as consumer
products.  He also lectures and authors articles in the areas of
products liability/toxic torts, and provides seminars on minimizing a
manufacturer's product liability risks.

Chris Wilkinson is a Principal Research Engineer in the Central
Technical Department of Smiths Industries located at Cheltenham UK.
He is undertaking research into the processes and procedures required
to use commercial grade components in aerospace applications, the
management of electronic component obsolescence and making process and
procedure recommendations to the Aerospace Business units.  He
graduated in 1972 with a BSc (Hons) in Electronics from London
University and joined GEC-Marconi as a junior engineer.  Following
periods with Racal (Slough) Ltd and Group 4 Total Security he joined
Smiths Industries in 1979 as a hardware engineer working on Flight
Control Systems.  He moved to his present position in 1990, where he
has undertaken near term hardware related research tasks.  He is a
Member of the Institution of Electrical Engineers.

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IPCWorks -October 25-28 featuring an International Summit on Lead-Free Electronic
Assemblies.
Please visit IPC's Center for Lead-Free Electronics Assembly
(http://www.ipc.org/html/leadfree.htm ) for additional information.
For technical support contact Gayatri Sardeshpande [log in to unmask] or 847-790-5365.
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