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July 2008

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Subject:
Re: [TN] SN100 for Reflow Application
From:
Joe Fjelstad <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Mon, 21 Jul 2008 00:24:39 EDT
Content-Type:
text/plain
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text/plain (24 lines) 
Any thoughts here relative to the prospective efficacy of using a  fraction 
of a micron of Ni over copper on the circuit board (or  perhaps under a copper 
flash with an OSP) with just straight,  non-proprietary SN100? (with the 100 
ppm of not intentionally  added Pb also included, of course... ;-)   
 
Cheers,  
Joe





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