Pete and Bob,

I have been involved in the assembly of PCB's utilizing Sn63, high lead and
lead free solders on various metallizations.  I found it highly impractical
to develop a solderability standard for each combination of solder and
metallization.  Solderability, the affinity of tin to wet to a metallization,
is normally used to predict the outcome of an assembly operation.  If the
current industry standards are kept as the benchmark for evaluating
solderability, it is then a matter for the process engineer to optimize
his/her process for his/her solder/metallization combination.  Using this
approach, I found it very predictive, simplifies the implementation of
alternative solders.

Larry Tawyea

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