Ryan ; nothing to apologize for                  
did not mean it that way .
It was actually more of my misunderstanding of the topic than yours ;
as Andy's high lead note explained well enough :
The topic is actually more LEAD itself ; not us much as LEADFREE .

sorry Ryan, you did land your note correctly . (thanks Andy) 

Paul Klasek
http://www.resmed.com

-----Original Message-----
From: Ryan Jennens [mailto:[log in to unmask]]
Sent: Friday, June 25, 1999 10:58 PM
To: [log in to unmask]
Subject: Re: [LF] FW: [LF] Recommended ALLOYS ; independent papers


I apologize to all, as I am still not used to the specific topic of the new
forum.  This should have been directed to the TechNet.  Please disregard (or
answer offline!).

-Ryan Jennens
TelGen Corporation

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of Paul Klasek
Sent: Thursday, June 24, 1999 7:11 PM
To: [log in to unmask]
Subject: [LF] FW: [LF] Recommended ALLOYS ; independent papers


Ryan/Guenter

This is going to be interesting (thanks for the note Ryan) ;

I just thought, on this particular Bismuth alloy, why is it considered right
from start ? :
It's got more lead than standard 63/37 SnPb !
When we say Leadfree ; do we mean 0 lead ?
I can't see much point in exercising options with more lead still ; however
interesting the subject may be .

Am I missing something ?

Talking about learning as much as ; does anybody have access to Hitachi ;
IBM ; etc. internal reports on leadfree evaluations in some nonproprietary
form ?
Yes ; I know it's wishful cry


Paul Klasek
http://www.resmed.com <http://www.resmed.com>



-----Original Message-----
From: Ryan Jennens [mailto:[log in to unmask]]
Sent: Thursday, June 24, 1999 11:19 PM
To: [log in to unmask]
Subject: Re: [LF] Recommended ALLOYS ; independent papers


Guenter-

    I have had some dialogue with Dave F. about the suitability of
43Sn43Pb14Bi solder paste.  I have attached his e-mail and he says that
during reflow a new alloy forms which has a melting point of 98C.  This new
alloy has lower tin and lead contents and a raised Bismuth content.  Where
does the extra Bismuth come from and where does the tin/lead go?  I am going
to guess in advance that an exclusively tin/lead alloy forms along with the
Bismuth alloy with a different crystal structure.  Why doesn't this alloy
form when the original alloy is formed for the paste manufacturer?  Thanks
in advance.

Trying to learn as much as I can,
Ryan Jennens
TelGen Corporation

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of Guenter Grossmann
Sent: Thursday, June 24, 1999 4:43 AM
To: [log in to unmask]
Subject: Re: [LF] Recommended ALLOYS ; independent papers


Paul

I find it hard to find good papers regarding lead-free soldering. In my
opinion there are not many alloy in sight that can substitute Tin / Lead.
- Indium alloys not suitable, not enough Indium
- Bi alloys dangerous since not usable with lead containing alloys
(components). Lead will alloy with Bi lowering the melting point below 100°C
- Tin- Copper: has the highest melting point of all lead free solders
- Tin Zink : I have not much infos.
- I think ternary alloys such as SnAgCu will be the best choice.

Reliability is not yet satisfactorily tested ( I think ). I will try to
start a project ( sigh ) next year.

Best regards

Guenter
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Please visit IPC's Center for Lead-Free Electronics Assembly
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For technical support contact Gayatri Sardeshpande [log in to unmask] or 847-790-5365.
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