I agree- it's pretty clear that we're all suffering through this.

----- Original Message -----
From: <[log in to unmask]>
To: "David Suraski - AIM" <[log in to unmask]>
Sent: Monday, April 17, 2000 10:37 AM
Subject: Re: [LF] DTI update report


>
> I appreciate your viewpoint, and yes we all have a problem with the pass
> through of our material to the next guy's technology.  We think in terms
of
> how to make the most of our component for the circuit operation, and then
> we struggle to get that technology to the circuit board because of the
> barriers in between.  Change is happening and we do not have any problem
> with the high temperature of soldering.  It is just that the levels of ppb
> are difficult to confirm in the real world and so evey caution that can be
> made to preserve the ceramic chip capacitor during attachment is required.
>
> I agree that the reflow characteristics of polymers is still pretty slow.
> I just think that the whole issue is so complex that we should not make
> statements like I am making and someelse said that the component makers
are
> not doing their fair part in this.

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