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| From: | |
| Reply To: | (Leadfree Electronics Assembly Forum) |
| Date: | Wed, 18 Jul 2007 07:53:53 -0700 |
| Content-Type: | text/plain |
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Unfortunately RoHS6 is not actually a standard.
Since RoHS 6 is generally recognized by telecoms as being compliant
INCLUDING not using the lead in solders exemption for telecommunications
then I would say that no it would not be "RoHS6" as it does use lead in
solder and could not meet the full spec without using the flip chip package
exemption. Maybe there should be a RoHS 5.5................8-)
John Burke
(408) 515 4992
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Tan, Geok Ang
Sent: Tuesday, July 17, 2007 6:48 PM
To: [log in to unmask]
Subject: [LF] RoHS 6 product?
Hi All,
If a product is assembled using lead-free processes 2nd level
connectivity) but one of the ASIC package coming with a internal
Flip-Chip package which is used high temp SnPb solder bumps/balls (1st
level connectivity).
Can the product declare as RoHS 6 product? Or such it be
declares as RoHS 6 with exemption?
Regards
GA Tan
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