Dear Alexandra,
I am sure that we would have substantial contributions to this conference.
However, before sending an abstract, I would like to know 
- the deadline for the submission of the abstract
- whether a publication of the presentations is planned
- the deadline for paper submission (if any)

Furthermore I would like to know, whether there is already any feedback on
this conference and how many people you expect to participate. The time
frame for preparation is pretty tight and thus I would appreciate to get the
requested info as soon as possible.

Thanks in advance,
Marc

-----Ursprüngliche Nachricht-----
Von: Alexandra Curtis [mailto:[log in to unmask]]
Gesendet am: Donnerstag, 18. September 2003 19:44
An: [log in to unmask]
Betreff: [LF] IPC Seeking Industry Experts on Tin Whiskers

IPC is CALLING FOR YOUR PARTICIPATION AT THE......

International Conference on Tin Whiskers: The Unexplained Phenomenon
Technical Conference and Tabletop Exhibits: November 5-6, 2003
Holiday Inn Research Park ● Huntsville, AL

What is Tin Whiskers you say? Tin whiskers are single crystal structure of
tin that grows unexpectedly from the surface of pure tin, especially
electroplated tin. Tin whiskers are thought to be a “mechanical phenomenon”
but this is no new phenomenon. The first published report of tin whiskers
dates back to the 1940’s. 

Component manufacturers are being driven to eliminate lead from electronics
and consider pure tin coatings as an economical lead free plating option. It
has been rumored that electronic component manufacturers have announced
plans to increase the use of pure-tin coatings on leads and other external
and internal surfaces.

Years of study have been conducted regarding the mechanisms in which tin
whiskers grow and still not a single acceptable explanation for this
phenomenon exists. If the industry is going to demand the use of pure tin
coats, it’s time to investigate the phenomenon of tin whiskers.

Potential topics for presentations at the Tin Whiskers conference are:

• Whisker Failures
• Reliability issues
• Intermetallic Formation
• Compressive Stresses 
• Risk/Failure Mechanisms
• Debris/Contamination
• Environmental Factors
• Case Studies
• Plating Options/Solutions
• Accelerating Test Conditions
• Whisker Metallization

The International Conference on Tin Whiskers offers time slots between 30-45
minutes long. To submit an abstract, please include an abstract of 200-300
words describing the presentation you wish to have considered, along with a
brief biography and e-mail to [log in to unmask]

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