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March 2005

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Subject:
From:
Cliff Knudson <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Thu, 17 Mar 2005 08:48:13 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (175 lines)
Thanks Kay. I was under the impression that they would simply add to the list versus 
removing and moving around information. Silly me!

Cliff


-----Original Message-----
From: ext Kay Nimmo [mailto:[log in to unmask]]
Sent: Thursday, March 17, 2005 12:51 AM
To: (Leadfree Electronics Assembly Forum); Knudson Cliff
(Nokia-ES/MtView)
Subject: RE: [LF] Compliance by Exemption


Unfortunately the exemption numbers might not stay the same -
particularly no.10 which in the new draft refers to compliant pin
connectors......possibly you need to add another letter which identifies
the exemption number in a particular version of the exemption annex??
Kay

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Cliff Knudson
Sent: 17 March 2005 02:09
To: [log in to unmask]
Subject: Re: [LF] Compliance by Exemption

Hi Roland,
We are tracking by exemption as some exemptions may expire at different 
times. It is important for the suppliers to communicate what exemption 
they are claiming to ensure we are all in agreement. The logic is we can

continue to add as exemptions increase and we tell simply by looking at
the
number which exemption Exactly the supplier is claiming.
Here is an example of what we are using;

Exemption Status Indicator      Flag
1. Mercury in compact fluorescent lamps not exceeding 5 mg per lamp.
E1.1
2. Mercury in straight fluorescent lamps for general purposes not
exceeding:	
- halophosphate 10 mg   E2.1
- triphosphate with normal lifetime 5 mg        E2.2
- triphosphate with long lifetime 8 mg. E2.3
3. Mercury in straight fluorescent lamps for special purposes.  E3.1
4. Mercury in other lamps not specifically mentioned in this Annex.
E4.1
5. Lead in glass of cathode ray tubes, electronic components and
fluorescent tubes.      E5.1
6. Lead as an alloying element in steel containing up to 0,35 % lead by
weight, aluminium containing up to 0,4 % leadby weight and as a copper
alloy containing up to 4 % lead by weight.      E6.1
7. - Lead in high melting temperature type solders (i.e. tin-lead solder
alloys containing more than 85 % lead), E7.1
- lead in solders for servers, storage and storage array systems
(exemption granted until 2010), E7.2
- lead in solders for network infrastructure equipment for switching,
signalling, transmission as well as network management for
telecommunication,      E7.3
- lead in electronic ceramic parts (e.g. piezoelectronic devices).
E7.4
8. Cadmium plating except for applications banned under Directive
91/338/EEC (1) amending Directive 76/769/EEC (2) relating to
restrictions on the marketing and use of certain dangerous substances
and preparations.       E8.1
9. Hexavalent chromium as an anti-corrosion of the carbon steel cooling
system in absorption refrigerators.     E9.1
10. Within the procedure referred to in Article 7(2), the Commission
shall evaluate the applications for:	
- Deca BDE,     E10.1
- mercury in straight fluorescent lamps for special purposes,   E10.2
- lead in solders for servers, storage and storage array systems,
network infrastructure equipment for switching, signalling, transmission
as well as network management for telecommunications (with a view to
setting a specific time limit for this exemption), and  E10.3
- light bulbs, as a matter of priority in order to establish as soon as
possible whether these items are to be amended accordingly.     E10.4

Take care,
Cliff


-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of ext Roland Ducote
Sent: Wednesday, March 16, 2005 3:02 PM
To: [log in to unmask]
Subject: [LF] Compliance by Exemption


Hello All,

There has been alot of discussion concerning current exemptions and the
possiblity of future exemptions on board level components. For example
the
exemption of Annex 7, lead in high melting temperature solders.

At the engineering and even the procurement level, does this information
need to flow through the supply chain? We all know that an engineer
during
the design cycle needs the ability to design in part that is RoHS
compliant.
(e.g. part number, abc123, from XYZ Semiconductor is RoHS Compliant)

However, does there need to be an additional level of detail that
exhibits a
part as RoHS Compliant by Exemption? (e.g. part number, abc123, from XYZ
Semiconductor is RoHS Compliant by Exemption)

Finally, does there need to be further level of detail on the actually
exemption? (e.g. part number, abc123, from XYZ Semiconductor is RoHS
Compliant by Exemption per Annex 7)

Regards,

Roland X. DuCote
Arrow Electronics, Inc.
TEL: 303-645-8832
CELL: 720-201-9515
[log in to unmask]

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