Good morning everyone!  

 

I have some applications which are going to be double sided SMT with
minimal thru-hole additions.  Our process is to run the bottom side SMT
first (side 1), inspect, and then run the top side SMT second (side 2).
The overall board is approx. 8" X 7" and a 6 layer board.  My question
is: 

 

1.)     What is the nominal temperature in which a SAC 305 soldered SMT
joint from "side 1" will reflow again?  The reason I am asking is this
particular application has a couple 256 pin and 208 pin QFPs on both
sides of the board.

 

2.)     At what temperature range will these side 1 components begin to
reflow again?

 

 

Any assistance would be appreciated.

 

Thanks,

 

Rich 


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