Hi Guenter or Günter, and IPC LF Listservers,
Thank You.
Did you interpolate or extrapolate the data points for the strains
at 20MPa listed on page 2?
Based on the little I have read on this NCMS report, which covered
a wide temperature range and many solder compositions, I believe
you interpolated the strains?
I am searching for some review papers after this report was published
to see if I can learn more about this report. I have found one by
P.Vianco
YiEngr, MA/NY DDave
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