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October 2003

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Subject:
From:
MA/NY DDave <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Sat, 4 Oct 2003 23:53:37 -0500
Content-Type:
text/plain
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text/plain (26 lines)
Hi Guenter or Günter, and IPC LF Listservers,

Thank You.

Did you interpolate or extrapolate the data points for the strains
at 20MPa listed on page 2?

Based on the little I have read on this NCMS report, which covered
a wide temperature range and many solder compositions, I believe
you interpolated the strains?

I am searching for some review papers after this report was published
to see if I can learn more about this report. I have found one by
P.Vianco


YiEngr, MA/NY DDave

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