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Subject:	Re: Delamination on lead free reflow cycling
From:	Phil Nutting <[log in to unmask]>
Reply To:	(Leadfree Electronics Assembly Forum)
Date:	Thu, 10 Nov 2005 16:14:04 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (50 lines)

John,

I'm in the process or ordering several different laminates for a similar
test.  I'd be very interested in your results.

Phil Nutting 

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Thursday, November 10, 2005 2:03 PM
To: [log in to unmask]
Subject: [LF] Delamination on lead free reflow cycling

I have been cycling some bare test boards to the JEDEC 020 spec for lead
free reflow trials. I have noticed a tendency for early de-lamination of
areas of the board with copper flood fill on the surface.

This is only occurring after extended cycling, and I have the same
effect
from 3 different board manufacturers using 3 different high temperature
laminate constructions.

Anyone else noticed this??

John

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