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August 2003

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Subject:
Re: PCB finishing type for lead free solution with CSP, BGA & press-fit connector
From:
MA/NY DDave <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Wed, 20 Aug 2003 20:34:13 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (19 lines) 
Hi Tyco-Bob, and IPC-LF Listserve,

Thanks it looks like a nice report from your European colleages.

Has an experiment with SnAgCu as the alloy for HAL (or HASL)
been discussed?

YiEngr, MA/NY DDave

P.S. Are you out of the Boston area?

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