NEC (California Eastern Labs, CEL) is using Bi, and has some generic
documents about why they switched to this on their website. They state that
SnBi is recommended by JEITA, a standards org similar to JEDEC, but JEDEC
has taken the opposite position, against SnBi. Maybe you can find something
on the JEITA site?
-----Original Message-----
From: John Barnes [mailto:[log in to unmask]]
Sent: 28-Apr-05 2:54 PM
To: [log in to unmask]
Subject: Re: [LF] SnBi parts in SnPb paste
Bill,
See "Quality Evaluation Data for Lead-free SMD Peripheral Packages
(Sn-Bi plating) Seiko Epson, Aug. 30, 2002, at
http://www.epson.co.jp/e/community/pdf/sn-bi__e2_031104.pdf
In the last four months I've collected over 100 books and well over
2,300 papers/magazine articles on designing electronics to be lead-free,
RoHS-compliant, and WEEE-compliant. Searching my bibliography at
http://www.dbicorporation.com/rohsbib.htm ,
this is the only one that jumped out at me from the titles. Which is
rather curious, because if you look at the "Lead-Free and RoHS-Compliant
Electronic Components" section of my web page
http://www.dbicorporation.com/rohs.htm
you will see that 21 manufacturers state that they use SnBi lead plating
on some of their parts. And we can't change to the SnAgCu or SnCu
lead-free solder until all of the components on a board can withstand at
least 245 degrees Celsius soldering temperature...
I know that I've seen more information on mixing SnPb solder with SnBi
platings, including warnings about an SnPbBi alloy that melts at 96
degrees Celsius, but I don't know just where it is hiding in the four
shelves of books and my five-drawer file cabinet. Oh, well. That is
why I am trying to summarize all this information, with the reference
sources, in the latter web page.
John Barnes KS4GL, PE, NCE, ESDC Eng, PSE, SM IEEE
dBi Corporation
http://www.dbicorporation.com/
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