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September 2003

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Subject:
From:
MA/NY DDave <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Fri, 26 Sep 2003 10:29:27 -0500
Content-Type:
text/plain
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text/plain (41 lines)
Hi Elina,IPC LF Listservers,

Let me give you one item I found fast.

Keep us, or even just me updated and educated on web links; particularly,
 if you find something with Im-Sn.

------------
TIN-PLATING, TIN-NICKEL ELECTROPLATE AND TIN-PLATING OVER NICKEL AS FINAL
FINISHES ON COPPER
Author :    Phillip E. Hinton
Author Company :   Hinton  PWB Engineering
Date :  09/10/1996    Conference : Surface Mount International

Abstract : Tin-plating over copper for printed boards is a solderable lead
free substitute for other final finishes. It can be applied by conventional
printed board manufacturing process. Concern over tin whiskers and tin pest
and ways of decreasing these possible problems are discussed.
--------------
You can access this document if you are an SMTA member.
--------------

Lots of this research was done back in the 60's and maybe some in the
early 70's for the printed circuits industry. You will have to use one
of the technical data bases to get at this information. Fast thoughts
are BRS ?? / Dialog / and a few others.  You might also search another
industry like the surface finishing for metals and plastics that might
have current information.



YiEngr, MA/NY DDave

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