I'm looking for information on how much of an issue cross contamination
of solder tips with lead free solder and sn63 solders will be regarding
Rohs compliance.  Our current assumption is that we need separate solder
stations to prevent cross contamination and non-compliance on a lead
free assembly.  Are you aware of any studies done on this issue?  If I
use a leaded solder on a solder tip, and then clean and re-wet with lead
free solder on the same tip, how much contamination can occur?  Enough
to warrant separate stations?  Our production facilities will have
clearly marked separate stations but I'm also responsible for proto and
development stations and don't want to over-react if I don't have to.

 

I am aware of the reliability issues and am only concerned with Rohs
compliance at this time.

 

Thanks for any info you might have or pointing me in the right
direction.

 

Dave Hornback

Operations Manager

Qualcomm Incorporated

858-658-2136

 


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