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| From: | |
| Reply To: | (Leadfree Electronics Assembly Forum) |
| Date: | Sun, 2 Apr 2006 18:05:05 -0500 |
| Content-Type: | text/plain |
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I deal with this all the time outside of GD. I simply request the board
be changed to immersion silver finish and all of the problems disappear.
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Friday, March 31, 2006 2:49 PM
To: [log in to unmask]
Subject: Re: [LF] Brittle Interfacial fractures of SAC405 BGAs on ENIG
PCBs
Yes Daniella I have experienced this, but I believe you mean "opens" nt
shorts.
John
John Burke
Senior Manager - Operations , Optichron
[log in to unmask]
W: 510 249 5233
M: 408 515 4992
http://www.optichron.com
Profile: https://www.linkedin.com/e/fps/2665502/
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Danielle Casha
Sent: Friday, March 31, 2006 12:31 PM
To: [log in to unmask]
Subject: [LF] Brittle Interfacial fractures of SAC405 BGAs on ENIG PCBs
Hello All,
We are currently experiencing fractures with a SAC alloy BGA (I/O 529)
on an ENIG surface PCB. ICT is finding shorts at locations on the outer
rim of the BGA.
We sent a sample out to the lab, and with cross sectioning, they were
able to determine a fracture along the nickel/SAC intermetallic. I have
heard of problems with ENIG before, especially with Pb free alloys.
Has anyone else dealt with this before, and if so, how were you able to
overcome this?
All opinions/suggestions would be greatly appreciated.
Thank you,
Danielle L. Casha
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