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July 2009

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Subject:
Re: Plating SAC305
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Thu, 30 Jul 2009 14:56:08 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (66 lines) 
Kody, do you mean using a fused Sn97.3Ag.05 alloy, similar to the
commonly used fused SnPb (FTL) surface finish? After reflow, it would be
the same as SAC305.
I do not know if this has been done or not.

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Vladimir Igoshev
Sent: Thursday, July 30, 2009 2:40 PM
To: [log in to unmask]
Subject: Re: [LF] Plating SAC305

Hi Kody,

What SnAg "solution" you are talking about. No such solution exists.

Vladimir
SENTEC
------Original Message------
From: Kody
Sender: Leadfree
To: [log in to unmask]
ReplyTo: (Leadfree Electronics Assembly Forum)
ReplyTo: Kody
Sent: Jul 30, 2009 15:08
Subject: [LF] Plating SAC305

Has there been any success in plating SAC305 by either plating copper
then tin then silver or using a SnAg solution on copper?  More
specifically
for wafer bump plating.  Any information would be helpful.

                                        Thanks, Kody

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