Common molding compounds used for tantalum capacitors incorporate a
Brominated Monomer as a flame retardant. Note that this is a Monomer and
not a polymeric compound, such as the banned flame retardants PBB (Poly
Brominated Biphenyl) and PBBE (Poly Brominated Biphenyl Ether).  As a
percentage of the finished component weight, the flame retardant represents
about 2% of total weight.  That's roughly 1 to 5 mg per part, depending on
size.

Nancy Reynolds
KEMET Electronics






Guenter Eckart <[log in to unmask]>@IPC.ORG> on 12/03/99 09:37:58 AM

Please respond to "Leadfree Electronics Assembly E-Mail Forum."
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Sent by:  Leadfree <[log in to unmask]>


To:   [log in to unmask]
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Subject:  [LF] halide-free


Dear all,
we are, together with the lead-free actions, also working on
halide-free systems. With regard to semiconductor packaging (OFP, PLCC
etc. - epoxy mould compound) what is the halide content of the commonly
used flame retardants.
Who has a reliable number?
Thanks for your help.

Guenter Eckart
Alcatel SEL

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IPCWorks -October 25-28 featuring an International Summit on Lead-Free Electronic
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For technical support contact Gayatri Sardeshpande [log in to unmask] or 847-790-5365.
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