Hello Leo,

I personally think that your approach is too easy.
Just ask the lead free forum and everything will be presented on a platter.

In the real world it all depends on the application and the process.
So when I answer your questions with the limited info you gave it would look
something like this

1       OSP (only cost perspective)
2 Yes but it depends on how you specify "withstand"
3 A lot of data still has to be gathered, but it is the most common LF alloy
4 no but be carefull, labelling is becoming more important
5 see the web, visit seminars and read books,    the LF technology is
constantly evolving.

regards

Jowan Iven


-----Original Message-----
From:   Leadfree [mailto:[log in to unmask]] On Behalf Of Leo B. Buya
Sent:   dinsdag 26 oktober 2004 12:14
To:     [log in to unmask]
Subject:        [LF] lead free PCBA inquiry

Hi to all!

I am a PCB layout Engineer and been doing some reading/research for our Lead
Free assembly that includes the PCB, reflow and wave soldering
considerations, components to use and other Lead-free inputs applicable to
attain our Lead-free assembly. We manufacture Digital Enhanced Cordless
Phones. Our PCBs are normally 1.0mm thickness, FR4 (double sided) and sizes
ranges from 70mm x 80mm and above.

My questions are:
1. What can you recommend as the better PCB finish (plating) for such board
(DECT)?
2. Can a  FR4 with a Tg of 135ºC withstand the temperature required for
Lead-free and so with our PCB thickness?
3. Is a SnAgCu solder alloy best suited for such board?
4. Is it true that the assembly for lead-free must have separated assembly
area to that of the leaded assembly since contamination can occur?
5. Please provide me any information that are vital for our cross over to
Lead-free environment?

Your inputs are highly acknowledged. Thank you!

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