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November 2005

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Wed, 16 Nov 2005 10:48:32 EST
Content-Type:
text/plain
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text/plain (34 lines)
Hi Ofer,
I certainly know what MTTF and MTBF means, and for some things these concepts
work--MIL-HDBK-217 was built on them. However, for solder joints this is
different and that is why MIL-HDBK-217 does not work for solder attachments.
Solder joints are not equally loaded [the one's on the corners see
significantly more loading, everything else being equal]--that is why one always deals
with all the solder joints on a component. The solder joints on various
components have different loading conditions as well depending on component size,
solder joint geometry, and component power dissipation. The life of a compont's
solder attachment [all solder joints] is measured in terms of cycles not time
per se. That is why reliability models need to exist to determine an estimate
of the fatigue life of the solder attachments. There have to be different
models for leadless and leaded solder joints [here lead has nothing to do with Pb]
and different models for different solder alloys. We simply do not have the
data at this point for Pb-less solders to develop fatigue reliability models.

Regards,
Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL 32174 USA
Phone: 386-437-8747, Fax: 386-437-8737, Cell: 386-316-5904
E-mail: [log in to unmask], Website: www.engelmaier.com


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