This may be a silly question but as they say, No question is a silly
question so here it is :)

Would there be a difference in solder joint quality between 2 different size
components assuming the only difference is it's body size? For example, a
QFP208 and a QFP48. The PCB is well designed and the internal ground planes
are evenly distributed.

I would suspect the heat at the joints for both component would be almost
the same because both are exposed directly to the air, and therefore would
not affect solder joint quality.  The thermal mass of the component body I
believe would not impact the solder joint. If these were BGAs then the body
would have a greater influence but if they are only QFPs, would the
component body size make any difference??


Rgds
Dennis.


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