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June 2005

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Subject:
Re: Fw: [LF] Matte tin
From:
Roger Bilham <[log in to unmask]>
Reply To:
Roger Bilham <[log in to unmask]>
Date:
Tue, 7 Jun 2005 13:17:36 +0100
Content-Type:
text/plain
Parts/Attachments:
text/plain (70 lines) 
Dave, LFers,

The best paper I have seen on the whisker topic is:
Osenbach et al, "The Effects of Board Attachment Processing on Sn Whisker
Formation on Electroplated Matte-Sn on Copper Alloy Lead Frames", IPC/JEDEC
5th International Conference on Lead-Free Electronic Components &
Assemblies, San Jose, March 2004.

It helped me to piece together the various facts and theories. It may not be
available on the web but you should be able to get hold of the proceedings
fairly easily.

Regards,
Roger Bilham

----- Original Message -----
From: "MA/NY DDave" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, June 06, 2005 8:13 PM
Subject: Re: [LF] Fw: [LF] Matte tin


> Hi Pascal, John, IPC LF Listservers,
>
> BTW, I sympathize with John since I feel overloaded trying to read all
this
> LeadFree, Pb-free, stuff that is coming our way. On top of this comes the
> EU and EU member states which are having their own difficulty.
>
> Pascal, First a Question: Do you have any references (particularly www
easy
> links) to recent technical reports, or old, that describe what happens
with
> the 150C bake that alters future temperature, or mechanically created
> whisker formation. BTW 150C is not an option for all of the products and
> components that might use 100% tin finishes. Some might only be able to
use
> 120C or less.
>
> John, As an idea for search: If 150C works to reduce the formation in
> certain usage environments one should be able to look to Harsh
Environments
> to see them once again.
>
>
> Yours in Engineering, Dave
> YiEngr, MA/NY DDave
>
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