Dear all,

some Japanese companies (Sony, Matsushita, NEC) have a Sn-Bi-plating on some
of their components (as far as I know). I guess this will cause problems
when doing the board level assembly with Sn-Pb solder. 

Has anybody got any information on investigations concerning maximum
Bi-content in Sn-Pb-solders that is allowed to avoid both the appearance of
the binary Sn-Bi eutectic (138°C) and the ternary Bi-Pb-Sn eutectic (96 °C)?

Thank you for your comments

Dr. Marc Dittes

Infineon Technologies AG; CPD AIT LP DP
Assembly & Interconnect Technologies, Logic Products
Wernerwerkstr. 2
93049 Regensburg
Tel.:   ++ 49 941/202-3906
Fax.:   ++ 49 941/202-2024
email: [log in to unmask]

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