I would also think that variation E to 0.1% would be preferable. May be I
will prepare something for the committee.
Kay
+++++ Visit our lead-free.org website +++++
ITRI Ltd, Kingston Lane, Uxbridge, Middx, UK, UB8 3PJ
tel: +44 (0)1895 272406 fax: +44 (0)1895 251841
email: [log in to unmask] www.itri.co.uk and www.lead-free.org
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of Tim Skidmore
Sent: 08 February 2001 13:52
To: [log in to unmask]
Subject: Re: [LF] Pb content of Pb-free alloy
Currently for tin/lead alloys, variation "A" and "B" are the most commonly
produced. I can't really say for lead-free alloys since there is
relatively little production and I haven't had much input from our
competitors.
I personally think that most lead-free alloys (not containing Bi or Sb in
the alloy) should be produced to variation "E" requirements. The level of
lead should be kept well below the proposed definition of lead-free (0.2%
maximum). I have heard that some studies found that lead at levels of a
few tenths of a percentage may cause fillet lifting and/or other problems.
Again, I urge anyone with specific knowledge on impurity levels in
lead-free solders (scientific data, not opinions) to present it to the
J-STD-006 committee.
Sincerely,
Tim Skidmore
Multicore Solders, Inc.
Vice-chair J-STD-006 Working Group
Vasudivan Sunappan <[log in to unmask]>@IPC.ORG> on 02/08/2001 03:50:41
AM
Please respond to "Leadfree Electronics Assembly E-Mail Forum."
<[log in to unmask]>; Please respond to Vasudivan Sunappan
<[log in to unmask]>
Sent by: Leadfree <[log in to unmask]>
To: [log in to unmask]
cc:
Subject: Re: [LF] Pb content of Pb-free alloy
Hi Tim,
Do you know which variation in J STD 006 will be most widely used and
why?
Regards,
SV Divan
-----Original Message-----
From: Tim Skidmore
To: [log in to unmask]
Sent: 2/7/01 9:40 PM
Subject: Re: [LF] Pb content of Pb-free alloy
According to the current version of J-STD-006, the alloy Sn99Cu.7
Variation
"A" would be allowed a maximum of 0.10% Bi, 0.20% Pb and 0.50% Sb. The
variations "B" and "C" of this alloy would be allowed a maximum of 0.20%
Sb
and 0.05% Sb respectively with the same allowable limits for Bi and Pb.
Variation "E" for the alloy would be allowed maximums of 0.10% Bi, 0.10%
Pb
and 0.20% Sb.
The proposed revision A of the standard does not change these allowable
limits. If data exist that support that these limits are too high,
please
send it to me or David Dodgen at "[log in to unmask]". The proposed
revision
A is about to go to interim final for voting.
Sincerely,
Tim Skidmore
Multicore Solders, Inc.
Vice-chair J-STD-006 Working Group
Vasudivan Sunappan <[log in to unmask]>@IPC.ORG> on 02/07/2001
04:25:43
AM
Please respond to "Leadfree Electronics Assembly E-Mail Forum."
<[log in to unmask]>; Please respond to Vasudivan Sunappan
<[log in to unmask]>
Sent by: Leadfree <[log in to unmask]>
To: [log in to unmask]
cc:
Subject: [LF] Pb content of Pb-free alloy
Hi,
I received the following impurities specification for wave solder alloy
Sn/0.7Cu from a solder supplier.
Impurities Maximum Wt %
Antimony 0.50
Lead 0.20
Bismuth 0.10
Others
Is there any industry consensus on the amount of acceptable lead for
lead-free solder? Fillet lifting was shown in many studies of lead-free
solder contaminated with lead and bismuth. Any data on how much lead &
bismuth contamination is acceptable to avoid fillet lifting?
Regards,
SV Divan
> ----------
> From: Vasudivan Sunappan
> Sent: Thursday, October 12, 2000 5:21 PM
> To: [log in to unmask]
> Subject: PdAg & PtAg chip terminations
>
> Hi,
>
> There are some chip component manufacturers offering terminations in
> Palladium Silver (PdAg) and Platinum Silver (PtAg) styles. The
> manufacturer recommends these parts for adhesive attachment assembly.
It
> looks like suitable candidate for lead-free soldering assembly. Is
this
> feasible for soldering? Please share your experience.
>
> Regards,
> SV Divan
>
>
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