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Subject:	Re: [TN] SN100 for Reflow Application
From:	Werner Engelmaier /* <[log in to unmask]>
Reply To:	(Leadfree Electronics Assembly Forum)
Date:	Wed, 16 Jul 2008 12:46:47 EDT
Content-Type:	text/plain
Parts/Attachments:	text/plain (36 lines)

Keith,
To answer the original question, what we really need is families of 
stress-strain curves for various T's and strain rates for Sn37Pb, SAC305 and SN100C. 

in addition, creep rates, at least on a comparative basis between SAC305 and 
SN100C, would also be helpful in understanding the maximum stresses that can 
built-up on cooling from soldering T's.

Werner Engelmaier
Future workshops:
Solder Joint Reliability: Parts 1 through 4, July 17/18, Thal, Switzerland
Pb-Free Soldering Processes—Survival, Quality, Reliability, August 18, 
Orlando
Reliability Issues with Lead-Free Soldering Processes, September 22, 
Schaumburg
Failure Mode and Root Cause Analyses Reliability (Fatigue, Brittle Fracture, 
ENIG), September 22, Schaumburg
Solder Joint Reliability: Parts 1 & 4, Oct. 9, Moscow, Russia
Solder Joint Reliability: Parts 1 & 4, Oct. 22, Tallinn, Estonia



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