I've heard various rumors that lead-free solder may require the use of different PCB layout techniques, such as rounded pads, changes in placement of pads, etc., due to the difference in surface tension & wetting between leaded & lead-free solder.

  Has anyone else come across this? Does anyone know of any organization (IPC, Jedec, iNEMI, etc.) that may have issued a standard specifically for lead-free PCB layout concerns?  Or do the existing IPC standards pretty much cover all the relevant concerns?

  Many thanks in advance for any advice (either on- or off-list),
  -Camille Good
  Portland, Oregon


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