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| Reply To: | (Leadfree Electronics Assembly Forum) |
| Date: | Mon, 7 Mar 2005 08:30:41 +0100 |
| Content-Type: | text/plain |
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Dennis
Soldering lead free works fine with standard FR4 with a Tg of 140°C up to 6 layers. At least we tried it up to 6 layers in LEADFREE. With more layers cracking of through hole metallisations becomes anissue. However I know only of trials with more that 10 inner layers where this was the case.
Best regards
Guenter
EMPA
Swiss Federal Laboratories for Materials Testing and Research
Centre for Reliability
Guenter Grossmann, Senior Engineer
8600 Duebendorf
Switzerland
Phone: xx41 1 823 4279
Fax : xx41 1 823 4054
mail: [log in to unmask]
>>> [log in to unmask] 07.03.2005 04:20:12 >>>
Dear all,
I'm wondering if there is a general consensus when it comes to selecting a
laminate material for PCBs for Lead Free. Is the standard FR4 Tg 130C
adequate for Lead Free or would we need to move towards a higher grade
>Tg170.
I'm a little confused in that some say it is required to move to the higher
Tg to accomodate for the higher Assembly temperature while others say Tg
170C is unnecessary. Are people moving towards to the higher Tg as an
assurance or is it a requirement for the higher processing temperature?
Kind Regards
Dennis Bang
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