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July 2000

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
Leadfree Electronics Assembly E-Mail Forum.
Date:
Thu, 27 Jul 2000 14:46:47 EDT
Content-Type:
text/plain
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text/plain (27 lines)
Hi Bob,
Is the fillet lifting always associated with either Ag-containing solders
and/or Ag finishes?
Werner Engelmaier
In a message dated 07/27/0 10:57:22, [log in to unmask] writes:
>Interesting, is also probably even less well known that I have seen fillet
>lifting in both wave and reflow of through hole parts with SnAgCu and with
>SnCu in wave in both case the boards were silver finish and we do not believe
>there was and lead.
>The failures I have seen in my sectioning showed fillet lifting, pad lifting
>and fillet tearing. To date no one has been able suggest why this has
occurred !!!
>Bob Willis

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