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Reply To: | Leadfree Electronics Assembly E-Mail Forum. |
Date: | Thu, 27 Jul 2000 14:46:47 EDT |
Content-Type: | text/plain |
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Hi Bob,
Is the fillet lifting always associated with either Ag-containing solders
and/or Ag finishes?
Werner Engelmaier
In a message dated 07/27/0 10:57:22, [log in to unmask] writes:
>Interesting, is also probably even less well known that I have seen fillet
>lifting in both wave and reflow of through hole parts with SnAgCu and with
>SnCu in wave in both case the boards were silver finish and we do not believe
>there was and lead.
>The failures I have seen in my sectioning showed fillet lifting, pad lifting
>and fillet tearing. To date no one has been able suggest why this has
occurred !!!
>Bob Willis
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