Dear All

I have seen several references recently to 260°C as being the reflow
temperature for lead-free solder.

This is just a reminder that the IDEALS project found that satisfactory joints
(inspectable and reliable) were made using SnAg3.8Cu0.7 solder at a peak reflow
temperature on the joint of 225°C.

Obviously the temperature experienced by individual components depends on the
board and the process, but in my opinion the more likely temperature range of
concern for packages is to a max of 240°C (and even 230°C in a very tight
process) - still plenty hot enough, but not 260°C.  

Regards

James
+++++++++
    From: James H Vincent                          
          Marconi Materials Technology  
          Caswell, Towcester NN12 8EQ, UK
   
     Tel: +44 1327 356321 (direct), G-Net: +942 6321
          +44 1327 350581 (switchboard)
     Fax: +44 1327 356775
  E-mail: [log in to unmask] 
     WWW: http://www.gmmt.co.uk

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