See also High Cycle Fatigue testing of Pb free solder joints: By Nathan
Barry in Vol 19 Number 2 of Soldering and Surface Mount Technology 2007
http://www.emeraldinsight.com/Insight/viewContentItem.do;jsessionid=B94F
50206F1CDCF701B27D6B15EA6AE3?contentType=Article&contentId=1630609
which he completed as his thesis whilst working for us here at Goodrich
ECS and was also presented at a Pb-free symposium at NPL a couple of
years ago. He basically used an electro-magnetic vibration table with
model joints, which allowed testing at up to 2kHz. He showed an order of
magnitude reduction in fatigue life for Pb-free cf SnPb at room temp.
The actual article will be locked unless you subscribe to the magazine
or purchase it.
Regards
Ian Fox
Lead Materials and Process engineer
Goodrich ECS
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Woodrow, Thomas A
Sent: 08 December 2008 21:52
To: [log in to unmask]
Subject: Re: [LF] vibration testing of tin-lead and lead-free solder
joints
I would also suggest that anyone interested in vibration testing of
Pb-free solders go to
http://acqp2.nasa.gov/projects/LeadFreeSolderTestingForHighReliability_P
roj1.html. See Section 4.1 and Section 10.
-----Original Message-----
From: Joe Fjelstad [mailto:[log in to unmask]]
Sent: Monday, December 08, 2008 12:45 PM
To: [log in to unmask]
Subject: [LF] vibration testing of tin-lead and lead-free solder joints
Greetings folks
Found this on the wires today... (Cut it earlier out but lost the link
but I am sure I am not the only one who read it. However I can go dig
it up if
there is interest)
Why are we still using lead-free solder again? So it goes....
Joe
"Davide de Maio of National Physical Laboratory discussed the high
frequency vibration testing of tin-lead and lead-free solder joints,
with reference to automotive and aerospace electronics--a grim reminder
that 80% of failures in airborne electronics were attributable to
vibration and shock. A test piece had been designed representing a
single solder joint between two copper components, which was tested to
failure at frequencies of 400Hz and 800Hz. A range of SAC lead-free
solders had been evaluated, with tin-lead as a comparison.
The tin-lead solder outperformed the lead-free examples, especially at
the higher frequency. In general, failure occurred at or near the
intermetallic interface, which would be expected to be the most
stressed area. Of the SAC alloys, performance at 400Hz was better the
higher the silver content. Annealing of SAC had a deleterious effect on
performance at both 400Hz and 800Hz."
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