LEADFREE Archives

August 2001

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Subject:
From:
Philip Adamson <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Wed, 29 Aug 2001 06:27:59 -0700
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does anybody have any experience of changing over from tin/lead solder dip to a pure tin solder dip for through-hole discrete components? Are there any major problems associated with this? I would be interested to hear any comments people have.

thanks and regards

Philip Adamson
Development Engineer
International Rectifier GB

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