Hi Jerome
I believe that reference to 'unintentional' additions was removed from
the RoHS MCV decision because TAC felt it would be impossible to prove
if the haz material had been added intentionally or not at levels below
the maximum allowed.
Like you say there is another argument about whether intentional
additions should actually be used or not.
Kay
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-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Jerome Wagner
Sent: 08 December 2004 21:03
To: [log in to unmask]
Subject: [LF] ECP: [LF] Lead in ENIG plating
Steve: We are aware of Pb contents up to, let's say, 700 ppmw in
electroless Ni deposits... I am told that it functions in the deposit as
a grain refiner; in that sense, it is there intentionally.
For the present, I am considering this content to be RoHS-compliant,
based on the following rationale: 700 ppmw is less than the proposed MCV
of 1,000 ppmw; proposed MCV definition makes no mention of
"intentional". I further rationalize that the "intentional" concept was
negotiated away by forcing the "homogeneous material" definition to the
lowest level - i.e., the Ni deposit itself - such that averaging over
other materials in the assembly would not be allowed in order to make
the content "allowable". I am aware of academic arguments which would
have any intentional content prohibitted...
Certainly interested in validation of this understanding, as it is
pivotal to me!
jw
!! God Blesses !!
Jerry Wagner Dept 0056 Environmental Engineering B096-1
x56275 pg 58888-0658 (607)755-6275 fax: (607)755-6282
Huron Real Estate Associates, LLC and Endicott Interconnect
Technologies, Inc. Via the Internet: [log in to unmask] [NOTES:
Jerome Wagner/Huron/EIT]
Steve Bezuk
<steve.bezuk@KYOC To:
[log in to unmask]
ERA.COM> cc:
Sent by: Leadfree Subject: [LF] Lead in
ENIG plating
<[log in to unmask]
>
12/08/2004 01:00
PM
Please respond to
"(Leadfree
Electronics
Assembly Forum)";
Please respond to
Steve Bezuk
Forgive me if this has already been addressed. I have a question on the
interpretation of the lead that is found in ENIG platings. Lead
compounds are commonly used as a stabilizer for the Ni in e-less Ni
plating solutions. It is also commonly found in the Pd activator
solutions. The then becomes buried in the plating even though it is not
wanted or need in the final plating. I have not seen this issue
discussed except by the plating solutions companies that are working on
solutions. The question is whether or not this lead is considered
intentionally or unintentionally added. I have heard both
interpretations. I am also interested in comments on this issue. Some
materials proposed to replace the Lead although not on the RoHS list are
more toxic than the Lead and present in higher concentrations, Thallium
for instance.
Steve Bezuk, PhD
GM Market Development
Kyocera America Inc
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