Hi Greg, IPC LF Listservers,

<===
<I am wondering if anyone out there is re-balling lead-free BGA's with
tin-lead and would be willing share their experiences.   I see a few
vendors offer this service.  I don't doubt that it's feasible to do
this but I wonder how reliable the BGA interconnects would be after the
re-balling process.    Can re-balling be considered an interim solution
to the problem of soldering a LF BGA in a tin-lead process?>
<===

One company I can think of ordered several years of supply of SnPb BGA's
before the conversion to LF.

If your electronic/electrical designer strongly needs to use this
particular component, and the SnPb industry volume for this BGA stays
small, this reballing could become a permanent process.

ByTheWay, a good question considering potential military, etc applications.
Reballing as a standard long term process might add some reliability risks.

Yours in Engineering, Dave
YiEngr, MA/NY DDave

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