LEADFREE Archives

September 2003

Leadfree@IPC.ORG

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Subject:
From:
MA/NY DDave <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Tue, 16 Sep 2003 10:39:20 -0500
Content-Type:
text/plain
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text/plain (33 lines)
Hi UK's Sarah and IPC LF Listservers,

Great, a true LF topic.

Perhaps I can drag Tin's KayN into this topic, and get updated.

Most I know recommend a thorough separation of processing and materials
when going to Lead Free. Even with this process mentality some amount of
Lead will go into the joints so a minimum amount is allowed to be still
called lead free. By design <.1% by weight. There are some process
implementation problems that will be difficult particularly in smaller
shops.

According to the Japaneese document a Phase 0 is allowed on the equipment
implementation portion of the highway to work out this Leaded and LeadFree
transitioning phase (Roadmap 2002) via JEITA, Soldertec, others
cooperation. What this means for the content of Lead allowed in LF during
this short phase is unknown to me right now. By the way I think some have
already exited this Equipment Phase 0.

I am being brief, and trying to bait a little because Tin's Kay is on my
document as the contact person and Kay is a fine member of this Listserve.

YiEngr, MA/NY DDave

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